Fsi, excalibur isr, acid vapour clean


Subject: Fsi, excalibur isr, acid vapour clean
Deinstalled, barrier bagged, warehoused at the warehouse of SDI, Avezzano, Italy
Each systems contains two process modules and one control module.
Footprint is: 75 inches X 47.25 inches.
Cycle time for a dual module system is 70 WPH using the standard 200 Angstrom etch.
We had the system checked by a 3rd party service engineer.
He reported that the system is basically sound.
Here is a copy of his report, and I attach photos mentioned in the report:-
Model 901498-301, Serial 0904-0098-0995 (later process module 909000-300, 0904-0137-0397)
This system is dated September 1995. This was originally a single process chamber system. An additional module was added in March 1997. This second model has some later improvements.
No issues here. All parts are present and whole. There are a full set of manuals in the lower storage area.
There are some added items on the rear electronics panel these look like an interface to a factory gas detection system of data collection. These could be removed. (Pic 19).
Some contamination at the rear left of the slide rails and N2 regulator. All the systems seem to get this. Most of it comes from a standoff on the rear of the panel. It seems to corrode possibly due to its proximity to the extract manifold. (Pic 15).
The HF bottle connection was not capped off, this showed signs of browning which seems to be normal for a used system, but no flaking. Cracked the connection at the top of the flexi pipe and this was also OK.
Some rubber parts under the loader are starting to break up and crumble.
System has a cold plate added to sit behind the cassette.
The is no filter in the DI water filter housing. This is also normal.
Removed the top of the chamber and this looks clean. (Pic 22 to 25).
Removed the chuck and found some light corrosion of the top of the spindle. It could be that the o-ring is passing, It felt like the chuck had never been off before. (Pic 26).
Check the rubber seal on the lower chamber. This is used during rinsing. It looks like the module was used for a process that does not use the rinsing. The seal looked like it was starting to crack in one position. This is a low cost part. (Pic 27).
Again the same contamination at the rear left. (Pic 13).
However there is a lot of other contamination with the extracted area. There are white deposits over many of the surfaces. They have not caused any damage and may clean off well. But this does mean that there is either a leak somewhere or a poor purging set up. (Pic 12,13,14).
The original HF detector is missing. There is a controller for the detectior lying in the bottom and also what looks like a 3rd party detector. (Pic 13, 33, 34).
Removed the chamber and this looks good. (Pic 28 to 29).
Removed the chuck and there was corrosion on the spindle and also to the 2 screws which hold down the spacer. (Pic 30).
The lower chamber was ok and again no regular rinsing was used.
HF line again has some browning.
The tool contains two process modules.
The Excalibur* vapor phase processor is a single wafer processor for cleaning and etching. It uses HF as a cleaner and an etchant.To simplify clean and rinse operations, the system uses an in-situ'rinse (ISR) system.The excalibur is not normally used for removal of base wafer material, rather it is used as a cleaner for a subsequent process step.It's purpose is the removal of oxides or contaminant residues left or formed on the wafer as a result of some process step.It is used to promote better film adhesion during subsequent process steps.Typical process applications are after RIE wafer cleaning or cleaning prior to gate formation, polysilicon deposition,silicide layer deposition,contact metal deposition or epitaxial layer deposition..The last cleaning step is always HF, which has been shown to reduce residual metal contamination.
Anhydrous HF is used as a cleaning agent mixed with various amounts of N2 that has been moisturized by passing it through a vapor chamber containing deionized water.By careful control of the amount of moisturized N2 mixed with the HF, etch rate can be controlled in a range from 5 to 200 Angstroms/se. The Excalibur is completely computer controlled; therefore wafer contamination risks are reduced.
An Excalibur ISR consists of a control console and at least one ISR process module.
The Control Console consists of a power conditioner, a power supply, a power distribution and breaker box, a personal computer that provides the operator and maintenance interface and to run the control software, a second remote monitor and remote keyboard, digital input and output circuitry for monitoring and control of the system, analog I/O circuitry for control and monitoring of the variable functions of the wafer processor.
*Registered trade mark of FSI International.
SDI is not an authorized reseller of FSI products.
For more information and pictures on this machine follow the link below.
Check my "about me" page for more information